2013
Hardback (21 Mar 2013)
Includes delivery to the United States
10+ copies available online - Usually dispatched within 7 days
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
| ISBN: | 9781441957672 |
| Publisher: | Springer US |
| Imprint: | Springer |
| Pub date: | 21 Mar 2013 |
| Edition: | 2013 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 22 |
| Language: | English |
| Number of pages: | 560 |
| Weight: | 922g |
| Height: | 243mm |
| Width: | 162mm |
| Spine width: | 26mm |
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