Ultraclean Surface Processing of Silicon Wafers

Ultraclean Surface Processing of Silicon Wafers Secrects of VLSI Manufacturing

Softcover reprint of hardcover 1st ed. 1998

Paperback (07 Dec 2010)

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Publisher's Synopsis

A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

Book information

ISBN: 9783642082726
Publisher: Springer Berlin Heidelberg
Imprint: Springer
Pub date:
Edition: Softcover reprint of hardcover 1st ed. 1998
DEWEY: 621.3815
DEWEY edition: 22
Language: English
Number of pages: 616
Weight: 979g
Height: 229mm
Width: 152mm
Spine width: 36mm