Electronic Packaging and Interconnection Handbook

This is the most comprehensive reference in electronic packaging - completely updated. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, "Electronic Packaging and Interconnection Handbook" offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry.This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies. Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others. Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the "Electronic Packaging and Interconnection Handbook" makes an excellent addition to your reference arsenal.Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including: Materials; Thermal Management Shock, Vibration, and Operational Stress Management; Connector and Interconnection Technologies; Soldering and Cleaning Technologies; Single Chip Packaging and Ball Grid Arrays; Surface Mount Technology; Hybrid and Multichip Modules; Chip-Scale, Flip-Chip, and Direct-Chip Attachment; Rigid and Flexible Printed-Wiring Boards; Packaging High-Speed and Microwave Systems; Packaging High-Voltage Systems; Packaging of MEMs Systems; and, Packaging of Optoelectronic Systems.

ISBN 0071430482   Pages 1000 ISBN13 9780071430487 (What's this?)   Volumes 1 Publisher McGraw-Hill Education - Europe   Weight (grammes) 1769 Imprint McGraw-Hill Professional   Published in New York Format Hardback   Previous ISBN 9780071347457 Publication date 01 Nov 2004   Height (mm) 243 Non-book description 1 v. (various pagings) :   Width (mm) 198 Library of Congress 40559590   Spine width (mm) 46 DEWEY 621.381046   Academic level Professional / Scholarly DEWEY edition DC22

Ch. 1		Plastics, elastomers, and composites
Ch. 2		Adhesives, underfills, and coatings
Ch. 3		Thermal management
Ch. 4		Connector and interconnection technology
Ch. 5		Solder technologies for electronic packaging and assembly
Ch. 6		Packaging and interconnection of integrated circuits
Ch. 7		Hybrid microelectronics and multichip modules
Ch. 8		Chip scale, flip chip, and advanced chip packaging technologies
Ch. 9		Rigid and flexible printed circuit board technology
Ch. 10		Packaging of high-speed and microwave electronic systems

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. Sci-Tech Book News 20041201

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