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| ISBN | 087170823X | | Publication date | 22 Aug 2005 | | ISBN13 | 9780871708236
(What's this?) | | Library of Congress | TK | | Publisher | A S M Intl | | Pages | 523 p. | | Format | Hardback | | Volumes | 001 |
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| | | Diffractive lenses for high resolution laser based failure analysis by F. Zachariasse and M. J. Goossens | | 1 | | | | Dopant region imaging on front surface of silicon devices using a coaxial photon-ion column by R. G. Pajak and F. A. Baiocchi and E. Le Roy | | 8 | | | | Newly developed scanning laser-SQUID microscope by K. Nikawa and T. Sakai | | 14 | | | | Stacked-die failure mechanisms for an octal, current input 20-bit analog-to-digital converter by B. K. Craigin and B. L. Zhou and J. R. Bridgmon | | 21 | | | | Silver-on-silver versus tin-on-silver electrical connectors for high current and high vibration applications by P. Singh and J. Lloyd and J. Demarest and L. Palmer and L. Fischer and G. Hutt and G. Thompson and W. Brodsky | | 27 | | | | Analysis of Al-over-Cu bond pad hillock and pit hole defects by D. Cavasin and A. Yassine | | 31 | | | | Die edge thin film delamination on the bottom die of a stacked chip scale package (SCSP) by L. De la Rama and D. Nuarin and M. Nery | | 37 | | | | Multi-point probing on 65nm silicon technology using static IREM-based methodology by D. R. Bockelman and S. Y. C. Chen and A. Rahman and I. Wan and S. M. Ettinger | | 40 | | | | Failure analysis of soft single column failure in advanced nano SRAM device with internal probing techniques by H. S. Lin and W. T. Chang and C. H. Chao and J. Wang and C. T. Lin and C. Lin | | 46 | | | | The effectiveness of OBIRCH based fault isolation for sub-90 nm CMOS technologies by M. De la Bardonnie and K. Ly and R. Ross and F. Lorut and M. Lamy and C. Wyon and L. Kwakman and Y. Hiruma and J. Roux | | 49 | | | | Dislocation related leakage in advanced CMOS devices by F. Siegelin and A. Stuffer | | 59 | | | | Contacting diffusion with FIB for backside circuit edit - procedures and material analysis by U. Kerst and P. Sadewater and R. Schlangen and C. Boit and R. Leinkauf and B. Simmnacher and T. Lundquist and E. LeRoy | | 64 | | | | Novel and practical method of through silicon FIB editing of SOI devices by R. K. Jain and T. R. Lundquist and M. E. Antolik and M. A. Thompson | | 70 | | | | The joy of SOI : as viewed from a backside FIB perspective by S. Herschbein and C. Rue and C. Scrudato | | 78 | | | | Complementary optical techniques for advanced IC failure analysis - case study by J. Y. Liao and H. L. Marks and H. Deslandes | | 84 | | | More... | | |
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