ISBN: 9780871708236 - ISTFA 2005 : proceedings of the 31st International Symposium for Testing and Failure Analysis, November 6-10, 2005 ...

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ISTFA 2005 : proceedings of the 31st International Symposium for Testing and Failure Analysis, November 6-10, 2005 ...

International Symposium for Testing and Failure Analysis (31st : 2005 : San Jose, Calif.)

ISBN: 9780871708236
Format: Hardback
Publisher: A S M Intl

£79.20
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ISBN	087170823X		Publication date	22 Aug 2005
ISBN13	9780871708236 (What's this?)		Library of Congress	TK
Publisher	A S M Intl		Pages	523 p.
Format	Hardback		Volumes	001

		Diffractive lenses for high resolution laser based failure analysis by F. Zachariasse and M. J. Goossens		1
		Dopant region imaging on front surface of silicon devices using a coaxial photon-ion column by R. G. Pajak and F. A. Baiocchi and E. Le Roy		8
		Newly developed scanning laser-SQUID microscope by K. Nikawa and T. Sakai		14
		Stacked-die failure mechanisms for an octal, current input 20-bit analog-to-digital converter by B. K. Craigin and B. L. Zhou and J. R. Bridgmon		21
		Silver-on-silver versus tin-on-silver electrical connectors for high current and high vibration applications by P. Singh and J. Lloyd and J. Demarest and L. Palmer and L. Fischer and G. Hutt and G. Thompson and W. Brodsky		27
		Analysis of Al-over-Cu bond pad hillock and pit hole defects by D. Cavasin and A. Yassine		31
		Die edge thin film delamination on the bottom die of a stacked chip scale package (SCSP) by L. De la Rama and D. Nuarin and M. Nery		37
		Multi-point probing on 65nm silicon technology using static IREM-based methodology by D. R. Bockelman and S. Y. C. Chen and A. Rahman and I. Wan and S. M. Ettinger		40
		Failure analysis of soft single column failure in advanced nano SRAM device with internal probing techniques by H. S. Lin and W. T. Chang and C. H. Chao and J. Wang and C. T. Lin and C. Lin		46
		The effectiveness of OBIRCH based fault isolation for sub-90 nm CMOS technologies by M. De la Bardonnie and K. Ly and R. Ross and F. Lorut and M. Lamy and C. Wyon and L. Kwakman and Y. Hiruma and J. Roux		49
		Dislocation related leakage in advanced CMOS devices by F. Siegelin and A. Stuffer		59
		Contacting diffusion with FIB for backside circuit edit - procedures and material analysis by U. Kerst and P. Sadewater and R. Schlangen and C. Boit and R. Leinkauf and B. Simmnacher and T. Lundquist and E. LeRoy		64
		Novel and practical method of through silicon FIB editing of SOI devices by R. K. Jain and T. R. Lundquist and M. E. Antolik and M. A. Thompson		70
		The joy of SOI : as viewed from a backside FIB perspective by S. Herschbein and C. Rue and C. Scrudato		78
		Complementary optical techniques for advanced IC failure analysis - case study by J. Y. Liao and H. L. Marks and H. Deslandes		84
		More...

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