|
|
Patrick J. French, Kevin Chau
ISBN: 9780819429735
Format: Paperback
Publisher:SPIE Press
Write a review
An assessment of micromachined devices and components. It contains discussion of bonding and packaging, including wafer bonding with an adhesive coating, and examination of chemical and gas sensors, including acoustic-wave chemical microsensors in GaAs.
An assessment of micromachined devices and components. It contains discussion of bonding and packaging, including wafer bonding with an adhesive coating, and examination of chemical and gas sensors, including acoustic-wave chemical microsensors in GaAs.
| ISBN | 0819429732 | | DEWEY edition | DC21 | | ISBN13 | 9780819429735
(What's this?) | | Pages | 448 | | Publisher | SPIE Press | | Volumes | 000 | | Imprint | SPIE Press | | Published in | Bellingham | | Format | Paperback | | Series title | Proceedings of SPIE | | Publication date | 31 May 1999 | | Height (mm) | 230 | | Library of Congress | TA | | Academic level | Professional / Scholarly | | DEWEY | 621.3815 | |
|
| |
| | | Conference Committee | | | | | | Microassembly technologies for MEMS by M. B. Cohn and K. F. Bohringer and J. M. Noworolski | | 2 | | | | Finding markets for microstructures by J. W. Knutti | | 17 | | | | Micromachining technologies for miniaturized communication devices by C. T.-C. Nguyen | | 24 | | | | Brave new world of biobotics: technology and ethics meet once again by S. B. Crary | | 40 | | | | Micro-electro-optical devices in a five-level polysilicon surface-micromachining technology by J. H. Smith and M. S. Rodgers and J. J. Sniegowski | | 42 | | | | Wafer bonding with an adhesive coating by G. Klink and B. Hillerich | | 50 | | | | Simultaneous fabrication of dielectric and electric joints by wafer bonding by A. Drost and G. Klink and S. Scherbaum | | 62 | | | | Stress analysis for the optimization of a new plastic package for optical sensors by C. V. B. Cotofana and A. Bossche and J. R. Mollinger | | 72 | | | | Vacuum maintenance in hermetically sealed MEMs packages by A. Corazza and R. C. Kullberg | | 82 | | | | Chemical imaging sensor for observation of microscopic pH distribution by M. Nakao and S. Nomura and S. Takamatsu | | 92 | | | | Acoustic-wave chemical microsensors in GaAs by S. A. Casalnuovo and E. J. Heller and V. M. Hietala | | 103 | | | | Technological modules for on-chip integration of sensors with electronics by A. Gotz and C. Cane | | 112 | | | | Thin film front protection of CMOS wafers against KOH by U. Munch and N. Schneeberger and O. Paul | | 124 | | | | MEMS actuators based on smart film materials by E. Quandt | | 136 | | | | Three-dimensional active microcatheter combining shape memory alloy actuators and direct-drive tubular electrostatic micromotors by G. Bourbon and P. Minotti and P. Langlet | | 147 | | | | Performance of MEMS-based gas distribution and control systems for semiconductor processing by A. K. Henning and J. Fitch and J. M. Harris | | 159 | | | | Characterization techniques for surface-micromachined devices by W. P. Eaton and N. F. Smith and L. W. Irwin | | 171 | | | More... | | |
|
|
|
|
|
Enlarge
