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Martin W. Jawitz
ISBN: 9780070324886
Format: Hardback
Publisher:McGraw-Hill Education - Europe
Edition: 200th
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This book covers the total PCB construction process from the first glob of glass to the finished board, giving you all the materials information you need to make your designs work…
Select PCB materials for top performing boards. From weaving glass fiber mats to testing finished boards, this one-stop materials database offers the first close-up look at how to process and fabricate world-class PCBs. "Printed Circuit Board Materials Handbook" gives you a complete, hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials - plus the expertise to transform them into a high-performance printed circuit card.Packed with over 400 how-to illustrations, this encyclopedia tool gives you the know-how to: master the processes for glass fiber reinforcement, polyimide film, PET, PEN, and resins; work with copper foils, anodes, prepreg and laminates, aramid mats, and drill bits and routers; fabricate rigid and flexible printed wiring boards; apply the latest coating, laminating, etching, and electroplating methods; maximize techniques for hot air leveling, microsection analysis and electrical test; resolve controversial cleaning issues and CFC problems plus conduct troublshooting and failure analysis; and, much more.
| ISBN | 0070324883 | | Pages | 784 | | ISBN13 | 9780070324886
(What's this?) | | Volumes | 001 | | Publisher | McGraw-Hill Education - Europe | | Weight (grammes) | 1406 | | Imprint | McGraw-Hill Publishing Co. | | Published in | London | | Format | Hardback | | Series title | Electronic Packaging and Interconnection | | Publication date | 01 Jul 1997 | | Height (mm) | 231 | | Non-book description | 1 v. (various pagings) : | | Width (mm) | 157 | | Library of Congress | 97200298 | | Spine width (mm) | 58 | | DEWEY | 621.381531 | | Academic level | Professional / Scholarly | | DEWEY edition | DC21 | |
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| | | Preface | | | | | | Acknowledgments | | | | Ch. 1 | | Continuous Glass Fiber Reinforcements for Printed Wiring Board Applications by P. Douglas Lyle and Mark D. Kranjc | | | | Ch. 2 | | Fiberglass Reinforcement by Dennis J. Vaughan | | | | Ch. 3 | | Films, Polyimide by James Edman | | | | Ch. 4 | | Polyethylene Terphthalate and Polyethylene Napthalate for Printed Circuitry Applications by Thomas F. Gardeski | | | | Ch. 5 | | Punching Grade of Copper Clad Laminates by Robert J. Konsowitz | | | | Ch. 6 | | Resins by Jerome S. Sallo | | | | Ch. 7 | | Copper Foil by Rolland Savage | | | | Ch. 8 | | Anodes by Richard W. Strachan and Stephen C. Wright | | | | Ch. 9 | | Prepreg and Laminates by Chet Guiles | | | | Ch. 10 | | Nonwoven Aramid Reinforcement by David J. Powell | | | | Ch. 11 | | Drill Bits and Routers by Lee Schneider | | | | Ch. 12 | | Fabrication of Rigid Printed Wiring Boards by Phil Hinton | | | | Ch. 13 | | Fabrication of Flexible and Rigid Flexible Printed Wiring Boards by Phil Hinton | | | | Ch. 14 | | Primary Imaging Resist by Elmer Hayes | | | | Ch. 15 | | Etching Inner Layers by Rudy Sedlak | | | | Ch. 16 | | Oxide and Other Coatings for Inner Layer Bonding by David H. Ormerod | | | | Ch. 17 | | Lamination of Rigid Multilayer Board by Wil Gonzales | | | | Ch. 18 | | Lamination of Flex and Rigid-Flex Printed Wiring Boards by Dale McKeeby and Larry Phillips | | | | Ch. 19 | | Entry and Backup Material by Robert Norman | | | | Ch. 20 | | Drilling - Rigid and Flexible Printed Wiring Boards by Lee Ekblad and Dan Hylander and Russ Reynoso | | | | | More... | | |
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